1. Ukukwazi ukusebenza nge-brazeability
Kunzima ukubrasha izinto ze-ceramic kunye ne-ceramic, ze-ceramic kunye nezesinyithi. Uninzi lwe-solder lwenza ibhola kumphezulu we-ceramic, ngaphandle kokumanzisa kakhulu okanye ukungabi namanzi. Isinyithi esizalisa i-brazing esinokumanzisa ii-ceramics kulula ukwenza iintlobo ngeentlobo zee-brittle compounds (ezifana nee-carbides, i-silicides kunye nee-ternary okanye ii-multivariate compounds) kwindawo yokudibanisa ngexesha lokubrasha. Ubukho bezi compounds buchaphazela iimpawu zoomatshini ze-joint. Ukongeza, ngenxa yomahluko omkhulu we-thermal expansion coefficients phakathi kwe-ceramic, i-metal kunye ne-solder, kuya kubakho uxinzelelo olushiyekileyo kwi-joint emva kokuba ubushushu be-brazing bupholiswe bufikelele kubushushu begumbi, nto leyo enokubangela ukuqhekeka kwamalungu.
Ukumanzi kwe-solder kumphezulu we-ceramic kunokuphuculwa ngokongeza izinto zesinyithi ezisebenzayo kwi-solder eqhelekileyo; Ubushushu obuphantsi kunye ne-brazing yexesha elifutshane kunokunciphisa isiphumo se-interface reaction; Uxinzelelo lobushushu lwe-joint lungancitshiswa ngokuyila ifom efanelekileyo ye-joint kunye nokusebenzisa isinyithi esinye okanye esine-multi-layer njengomaleko ophakathi.
2. Isolder
I-ceramic kunye nesinyithi zihlala zidibene kwi-vacuum furnace okanye kwi-hydrogen kunye ne-argon furnace. Ukongeza kwiimpawu eziqhelekileyo, iintsimbi ze-brazing filler zezixhobo ze-elektroniki ze-vacuum kufuneka nazo zibe neemfuno ezithile ezikhethekileyo. Umzekelo, i-solder akufuneki iqulathe izinto ezivelisa uxinzelelo oluphezulu lomphunga, ukuze ingabangela ukuvuza kwe-dielectric kunye netyhefu ye-cathode kwizixhobo. Ngokuqhelekileyo kuchazwe ukuba xa isixhobo sisebenza, uxinzelelo lomphunga lwe-solder aluyi kudlula i-10-3pa, kwaye ukungcola koxinzelelo lomphunga oluphezulu oluqulethweyo akuyi kudlula i-0.002% ~ 0.005%; I-w (o) ye-solder ayifanele idlule i-0.001%, ukuze kuthintelwe umphunga wamanzi owenziwe ngexesha le-brazing kwi-hydrogen, enokubangela ukutshiza kwesinyithi se-solder esinyibilikisiweyo; Ukongeza, i-solder kufuneka icoceke kwaye ingabi nee-oxides ezingaphezulu.
Xa kusenziwa ibrashi emva kokwenziwa kwesinyithi se-ceramic, kungasetyenziswa ubhedu, isiseko, ubhedu lwesilivere, ubhedu lwegolide kunye nezinye iintsimbi ze-alloy brazing filler.
Kwi-brazing ngqo yee-ceramics kunye neentsimbi, kufuneka kukhethwe iintsimbi ze-brazing filler eziqulethe izinto ezisebenzayo i-Ti kunye ne-Zr. Iintsimbi ze-binary filler ikakhulu yi-Ti Cu kunye ne-Ti Ni, ezinokusetyenziswa kwi-1100 ℃. Phakathi kwe-ternary solder, i-Ag Cu Ti (W) (TI) yeyona solder isetyenziswa kakhulu, enokusetyenziswa kwi-straight brazing yee-ceramics kunye neentsimbi ezahlukeneyo. I-ternary filler metal inokusetyenziswa yi-foil, i-powder okanye i-Ag Cu eutectic filler metal ene-Ti powder. I-B-ti49be2 brazing filler metal inokumelana okufanayo nokugqwala kwintsimbi engatyiwayo kunye noxinzelelo lomphunga oluphantsi. Ingakhethwa ngokukhethekileyo kwiindawo zokuvala i-vacuum ezinokumelana ne-oxidation kunye nokuvuza. Kwi-ti-v-cr solder, ubushushu bokunyibilika buphantsi kakhulu (1620 ℃) xa i-w (V) ingama-30%, kwaye ukongezwa kwe-Cr kunokunciphisa ngempumelelo uhla lobushushu bokunyibilika. I-B-ti47.5ta5 solder ngaphandle kwe-Cr isetyenziselwe i-straight brazing ye-alumina kunye ne-magnesium oxide, kwaye ijoyinti yayo inokusebenza kubushushu obuphakathi be-1000 ℃. Itheyibhile 14 ibonisa i-flux esebenzayo yokunxibelelana ngqo phakathi kwe-ceramic kunye nesinyithi.
Itheyibhile 14 i-active brazing filler metals ze-ceramic kunye ne-metal brazing
2. Itekhnoloji yokurhawula
Iiseramikhi ezenziwe ngesinyithi zingafakwa kwi-braai kwigesi engenamanzi, i-hydrogen okanye indawo yokucoca umoya. I-braai ye-vacuum isetyenziselwa ukuqhobosha ngokuthe ngqo iiseramikhi ngaphandle kokuqhobosha umoya.
(1) Inkqubo yokugquma yonke inkqubo yokugquma yonke yeseramikhi kunye nesinyithi inokwahlulwa ibe ziinkqubo ezisixhenxe: ukucoca umphezulu, ukugquma ngepeyinti, ukwenziwa kwesinyithi kumphezulu weseramikhi, ukugquma nge-nickel, ukugquma kunye nokuhlolwa emva kokugquma.
Injongo yokucoca umphezulu kukususa amabala eoyile, amabala okubila kunye nefilimu ye-oxide kumphezulu wesinyithi esisisiseko. Iindawo zesinyithi kunye ne-solder kufuneka zisuswe kuqala, emva koko ifilimu ye-oxide kufuneka isuswe ngokuhlanjwa nge-asidi okanye nge-alkali, ihlanjwe ngamanzi aqukuqelayo kwaye yomiswe. Iindawo ezineemfuno eziphezulu kufuneka ziphathwe ngobushushu kwi-vacuum furnace okanye kwi-hydrogen furnace (indlela ye-ion bombardment nayo ingasetyenziswa) kubushushu obufanelekileyo kunye nexesha lokucoca umphezulu weendawo. Iindawo ezicociweyo azifanele zinxibe izinto ezinamafutha okanye izandla ezingenanto. Zifanele zifakwe kwangoko kwinkqubo elandelayo okanye kwi-dryer. Aziyi kuvezwa emoyeni ixesha elide. Iindawo ze-ceramic mazicocwe nge-acetone kunye ne-ultrasonic, zihlanjwe ngamanzi aqukuqelayo, kwaye ekugqibeleni zibiliswe kabini ngamanzi acocekileyo kangangemizuzu eli-15 ngexesha ngalinye.
Ukugquma intlama yinkqubo ebalulekileyo yokwenza isinyithi se-ceramic. Ngexesha lokugquma, kufakwa kumphezulu we-ceramic ukuze kwenziwe isinyithi ngebrashi okanye umatshini wokugquma intlama. Ubukhulu bentsimbi buhlala buyi-30 ~ 60mm. Intlama idla ngokulungiswa ngomgubo wesinyithi ococekileyo (ngamanye amaxesha i-oxide yesinyithi efanelekileyo iyongezwa) kunye nobukhulu besuntswana obumalunga ne-1 ~ 5um kunye ne-adhesive yendalo.
Iindawo zeseramikhi ezincamathiselweyo zithunyelwa kwisithando sehydrogen kwaye zitshiswe ngehydrogen emanzi okanye i-ammonia eqhekekileyo kwi-1300 ~ 1500 ℃ kangangemizuzu engama-30 ~ 60. Kwiindawo zeseramikhi ezigqunywe ngee-hydride, kufuneka zifudunyezwe ukuya kuthi ga kwi-900 ℃ ukuze zibole ii-hydride kwaye zisebenze ngesinyithi esicocekileyo okanye i-titanium (okanye i-zirconium) eseleyo kumphezulu weseramikhi ukuze kufunyanwe intsimbi kumphezulu weseramikhi.
Kwimaleko yesinyithi yeMo Mn, ukuze imanziswe nge-solder, umaleko we-nickel oyi-1.4 ~ 5um kufuneka ufakwe ngombane okanye ugqunywe ngomaleko we-nickel powder. Ukuba ubushushu bokugquma bungaphantsi kwe-1000 ℃, umaleko we-nickel kufuneka utshiswe kwangaphambili kwisithando se-hydrogen. Ubushushu kunye nexesha lokutshiza yi-1000 ℃ /15 ~ 20min.
Iiseramikhi ezicociweyo zizinto zesinyithi, eziya kuhlanganiswa zibe yintsimbi engagqwaliyo okanye igrafiti kunye neemold zeseramikhi. Isolder mayifakwe kwiindawo zokudibanisa, kwaye umsebenzi kufuneka ugcinwe ucocekile kulo lonke ixesha lokusebenza, kwaye akufuneki uchukunyiswe zizandla.
Ukugquma kufuneka kwenziwe kwi-argon, i-hydrogen okanye i-vacuum furnace. Ubushushu bokugquma buxhomekeke kwisinyithi esizalisa i-brazing. Ukuze kuthintelwe ukuqhekeka kweendawo ze-ceramic, izinga lokuphola alifanele likhawuleze kakhulu. Ukongeza, ukugquma kungasebenzisa uxinzelelo oluthile (malunga ne-0.49 ~ 0.98mpa).
Ukongeza ekuhlolweni komgangatho womphezulu, ii-weldments ezifakwe isinyithi nazo ziya kuvavanywa ngobushushu kunye nokuhlolwa kweempawu zoomatshini. Izixhobo zokuvala izixhobo zokucoca kufuneka nazo zivavanywe ukuvuza ngokwemigaqo efanelekileyo.
(2) Ukuqhobosha ngokuthe ngqo xa uqhobosha ngokuthe ngqo (indlela yesinyithi esebenzayo), qala ucoce umphezulu we-ceramic kunye ne-metal weldments, uze uzidibanise. Ukuze uphephe ukuqhekeka okubangelwa zii-coefficients ezahlukeneyo zokwandiswa kobushushu bezinto eziyinxalenye, umaleko we-buffer (umaleko omnye okanye ngaphezulu we-metal sheet) ungajikeleziswa phakathi kwe-weldments. Isinyithi sokuqhobosha kufuneka sibotshelelwe phakathi kwe-weldments ezimbini okanye sibekwe kwindawo apho isithuba sizaliswe khona nge-brazing filler metal kangangoko kunokwenzeka, kwaye emva koko ukuqhobosha kufuneka kwenziwe njenge-vacuum brazing eqhelekileyo.
Ukuba i-Ag Cu Ti solder isetyenziselwa ukurhawuzelela ngokuthe ngqo, indlela yokurhawuzelela nge-vacuum kufuneka isetyenziswe. Xa iqondo le-vacuum kwisithando somlilo lifikelela kwi-2.7 × Qala ukufudumeza kwi-10-3pa, kwaye ubushushu bunokunyuka ngokukhawuleza ngeli xesha; Xa ubushushu busondele kwinqanaba lokunyibilika kwe-solder, ubushushu kufuneka buphakanyiswe kancinci ukuze ubushushu bazo zonke iindawo ze-weldment bufane; Xa i-solder inyibilikisiwe, ubushushu kufuneka buphakanyiswe ngokukhawuleza bufike kubushushu be-brazing, kwaye ixesha lokubamba liza kuba yi-3 ~ 5min; Ngexesha lokuphola, kufuneka ipholiswe kancinci ngaphambi kwe-700 ℃, kwaye ingapholiswa ngokwendalo ngesithando somlilo emva kwe-700 ℃.
Xa i-solder esebenzayo yeTi Cu igqunywe ngqo ngebrashi, uhlobo lwe-solder lunokuba yiCu foil kunye neTi powder okanye iinxalenye zeCu kunye neTi foil, okanye umphezulu weceramic ungagqunywa ngeTi powder kunye neCu foil. Ngaphambi kokugqunywa, zonke iindawo zesinyithi mazikhutshwe nge-vacuum. Ubushushu bokukhupha igesi be-copper engenaoksijini bube yi-750 ~ 800 ℃, kwaye iTi, Nb, Ta, njl. kufuneka zikhutshwe ngerhasi kwi-900 ℃ kangangemizuzu eli-15. Ngeli xesha, i-vacuum degree mayingabi ngaphantsi kwe-6.7 × 10-3Pa. Ngexesha lokugqunywa, hlanganisa izinto eziza kudityaniswa kwi-fixture, zifudumale kwi-vacuum oven ukuya kwi-900 ~ 1120 ℃, kwaye ixesha lokubamba yi-2 ~ 5min. Ngexesha lonke lenkqubo yokugqunywa, i-vacuum degree mayingabi ngaphantsi kwe-6.7 × 10-3Pa.
Inkqubo yokuqhafaza ye-Ti Ni indlela ifana nendlela ye-Ti Cu, kunye nokushisa okutshisayo yi-900 ± 10 ℃.
(3) Indlela yokuqhoboshela i-oxide Indlela yokuqhoboshela i-oxide yindlela yokufumana unxibelelwano oluthembekileyo ngokusebenzisa isigaba seglasi esenziwe kukunyibilika kwe-oxide solder ukuze ingene kwi-ceramics kwaye imanzise umphezulu wesinyithi. Ingadibanisa ii-ceramics kunye nee-ceramics kunye nee-ceramics kunye neesinyithi. Iintsimbi zokuqhoboshela i-oxide brazing zenziwe ikakhulu yi-Al2O3, i-Cao, i-Bao kunye ne-MgO. Ngokongeza i-B2O3, i-Y2O3 kunye ne-ta2o3, iintsimbi zokuqhoboshela i-brazing ezineendawo ezahlukeneyo zokunyibilika kunye nee-coefficients zokwandiswa okuthe ngqo zinokufunyanwa. Ukongeza, iintsimbi zokuqhoboshela i-fluoride brazing ezine-CaF2 kunye ne-NaF njengezinto eziphambili zinokusetyenziselwa ukudibanisa ii-ceramics kunye neesinyithi ukuze kufunyanwe amalungu anamandla aphezulu kunye nokumelana nobushushu okuphezulu.
Ixesha lokuthumela: Juni-13-2022